95.5 Sn, 3.8 Ag, 0.7 Cu

Melting Temperature: 217°C

Type 3

Lead Free
Precision formulation.
Excellent resistance to humidity.
Suitable for fine pitch and print speeds up to 150mm/s
Low slump, low slip and low subsidence.
Exceptional wetting.
High joint brightness.

CAP AND STORE OUT OF SUNLIGHT.
USE WITHIN 6 MONTHS.

10g supplied in a syringe with 20G straight precision needle.  Perfect for working without stencils on BGA chips, SOIC's, SOP's without the irritation of bridged pins.

No clean RMA flux carrier system.  Our paste is made in small batches and to very tight quality controls.  Constantly evolving and improving!  This paste is the dogs .....

Comparison video coming soon.