62 Sn, 36 Pb, 2 Ag
Type 3
Precision formulation.
Excellent resistance to humidity.
Suitable for fine pitch and print speeds up to 150mm/s
Low slump, low slip and low subsidence.
Exceptional wetting.
High joint brightness.

CAP AND STORE OUT OF SUNLIGHT.

10g supplied in a syringe.  Perfect for working without stencils on BGA chips, SOIC's, SOP's without the irritation of bridged pins.

No clean RMA flux carrier system.

Check out our comparison video, it illustrates perfectly why you need to buy good solder paste!  The picture you can see above is of the 2 samples cleaned up after they where melted.  Both solders are leaded, the only differences in the two is the quality of the metals, the uniformity of the particle size, the addition of 2% silver and the carrier system.  So I suppose there are many differences.